DocumentCode :
3669963
Title :
Effect of AC corona discharge on hydrophobic properties of silicone rubber nanocomposites
Author :
M. Tariq Nazir;B.T. Phung;Mark Hoffman
Author_Institution :
School of Electrical Engineering and Telecommunications, University of New South Wales, Sydney, 2052, Australia
fYear :
2015
fDate :
7/1/2015 12:00:00 AM
Firstpage :
412
Lastpage :
415
Abstract :
In wet conditions, corona discharges may occur on composite insulator surfaces of well-designed power transmission equipment. Corona exposure gradually reduces the surface hydrophobicity and degrades the polymer surface. Recently, much attention has been paid on improvement of corona surface resistance by dispersing nanofillers in the base polymer. This paper presents experimental investigations to understand how silica filler loading can affect hydrophobic properties of RTV silicone rubber nanocomposites under AC corona discharge. Nano precipitated SiO2 with size of ~20 nm was used as filler. Silicone rubber nanocomposites with different nano SiO2 loading by weight were fabricated using mechanical stirring and ultrasonic water bath methods. A point-to-plane electrode geometry housed in a glass chamber was used to produce corona discharge at standard atmospheric pressure. The nanocomposite samples were placed between the electrodes, in direct contact with the plane electrode (ground) but separate from the point electrode by a fixed 5 mm air gap. The changes in hydrophobicity of test samples as a function of corona exposure time were determined by measuring the water static contact angle with a goniometer. The surface free energies of nanocomposite samples were calculated by considering the static contact angles of water and diiodomethane in relation to corona exposure duration. The surface morphology of nanocomposite samples was also studied by means of Transmission Electron Microscopy (TEM) and Scanning Electron Microscopy (SEM).
Keywords :
"Corona","Nanocomposites","Rubber","Surface discharges","Surface morphology","Surface treatment","Silicon compounds"
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
Electronic_ISBN :
2160-9241
Type :
conf
DOI :
10.1109/ICPADM.2015.7295296
Filename :
7295296
Link To Document :
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