Title :
Analysis on dynamic surface potential decay of functional nanocomposite after corona discharge
Author :
J. W. Zhang;T. C. Zhou;X. Chen;C. Yin;X. H. Zhang;R. Belouadah
Author_Institution :
School of Electrical Engineering, Northeast Dianli University, Jilin, China
fDate :
7/1/2015 12:00:00 AM
Abstract :
Surface charge on insulator polymers in breakers, gas insulated switchgears and other electrical apparatuses, plays a dominant role in the insulation performance of power system. Meanwhile, the surface potential on the functional dielectric can be one of the criteria in the evaluation of the charge storage performance when the dipoles formed in polymer are taken into consideration during corona poling procedure. In order to evaluate the influence on the charge storage property of insulator polymers, the samples were charged by a unipolar corona discharge set-up. Thus, the dynamic surface electrostatic dispersion phenomenon and tendency were observed and investigated. This paper concentrates on the effects of internal nano-particle structure on its traps, as well as the stability of surface charge functions, by comparing the surface potential dynamic characteristics of silicon insulating film mixed with nano-particles and pure silicon film. Meanwhile, the dynamic behavior of surface potential has been recorded and analyzed. The results obtained have demonstrated that the formation of charge will be restrained and the rate of surface charge decay will be enhanced if a small quantity of nano-particles is dispersed in a polymer matrix. The significance of the conclusion is that it provides essential reference value and practical effect for the development of insulation engineering and also for the functional dielectric materials applied in the field of sensors and actuators and energy harvesters etc..
Keywords :
"Surface discharges","Films","Silicon","Discharges (electric)","Corona","Electric potential","Dielectric materials"
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
Electronic_ISBN :
2160-9241
DOI :
10.1109/ICPADM.2015.7295395