• DocumentCode
    3670344
  • Title

    Wide bandgap (WBG) semiconductor power device datasheets and circuit models

  • Author

    Krishna Shenai

  • Author_Institution
    LoPel Corporation, Naperville, Illinois (USA)
  • fYear
    2015
  • fDate
    5/1/2015 12:00:00 AM
  • Firstpage
    32
  • Lastpage
    35
  • Abstract
    Accurate product datasheets and circuit models of components are necessary in order to design and manufacture low cost and reliable power electronic modules (PEMs) and power converters. A detailed review of the product datasheets and available circuit models of single-chip wide bandgap (WBG) discrete power devices is presented. The WBG power devices considered include lateral GaN power transistors, vertical GaN and SiC power diodes, and vertical SiC power MOSFETs. It is shown that significant improvements in both the datasheets and circuit models are needed for rapid commercialization of WBG power switching devices. This conclusion is based on in-house measurement of commercial devices as well as detailed review and comparison of WBG product datasheets and circuit models with comparable silicon power devices.
  • Keywords
    "Integrated circuit modeling","Temperature measurement","MOSFET","Semiconductor device measurement","Silicon","Schottky diodes"
  • Publisher
    ieee
  • Conference_Titel
    Integrated Power Packaging (IWIPP), 2015 IEEE International Workshop on
  • Type

    conf

  • DOI
    10.1109/IWIPP.2015.7295971
  • Filename
    7295971