DocumentCode
3670364
Title
Thermal interface material evaluation for IGBT modules under realistic power cycling conditions
Author
Garron K. Morris;Matthew Polakowski;Lixiang Wei;Martin D. Ball;Mark G. Phillips;Craig Mosey;Richard A. Lukaszewski
Author_Institution
Rockwell Automation, Low-Voltage Standard Drives, Mequon, Wisconsin
fYear
2015
fDate
5/1/2015 12:00:00 AM
Firstpage
111
Lastpage
114
Abstract
The long-term reliability of the thermal interface material (TIM) between an IGBT and heat sink is a critical aspect of motor drive design and customer satisfaction. Studies in the literature have focused on TIM characterization using idealized flat surfaces that are not representative of the wavy mounting surface found on IGBT base plates. In the authors´ experience, there is limited correlation between TIM data sheet specifications obtained using idealized flat surfaces and the actual thermal and long-term reliability performance observed in the field. This paper describes the test process and test fixture designed to evaluate TIMs under real world power cycling conditions using actual IGBT modules and heat sink surfaces. Commercially available non-silicone oil thermal greases from three suppliers were tested with the TIM thermal resistance and junction temperatures measured approximately every 5000 cycles. A thermal grease was found to be most stable over 15,000 power cycles. Furthermore, chemical analyses indicated that the best-performing TIM has the smallest particle size of the three manufacturers.
Keywords
"Insulated gate bipolar transistors","Junctions","Temperature measurement","Thermal resistance","Cold plates","Reliability","Heat sinks"
Publisher
ieee
Conference_Titel
Integrated Power Packaging (IWIPP), 2015 IEEE International Workshop on
Type
conf
DOI
10.1109/IWIPP.2015.7295991
Filename
7295991
Link To Document