• DocumentCode
    3677258
  • Title

    Enabling large-scale deployment of photonics through cost-efficient and scalable packaging

  • Author

    Tymon Barwicz;Yoichi Taira;Ted W. Lichoulas;Nicolas Boyer;Hidetoshi Numata;Yves Martin;Jae-Woong Nah;Shotaro Takenobu;Alexander Janta-Polczynski;Eddie L. Kimbrell;Robert Leidy;Marwan Khater;Swetha Kamlapurkar;Sebastian Engelmann;Yurii A. Vlasov;Paul Forti

  • Author_Institution
    IBM T.J. Watson Research Center, 1101 Kitchawan Rd., Yorktown Heights, NY 10598 USA
  • fYear
    2015
  • Firstpage
    155
  • Lastpage
    156
  • Abstract
    Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.
  • Keywords
    Decision support systems
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2015 IEEE 12th International Conference on
  • Type

    conf

  • DOI
    10.1109/Group4.2015.7305910
  • Filename
    7305910
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3677258