Title :
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
Author :
Tymon Barwicz;Yoichi Taira;Ted W. Lichoulas;Nicolas Boyer;Hidetoshi Numata;Yves Martin;Jae-Woong Nah;Shotaro Takenobu;Alexander Janta-Polczynski;Eddie L. Kimbrell;Robert Leidy;Marwan Khater;Swetha Kamlapurkar;Sebastian Engelmann;Yurii A. Vlasov;Paul Forti
Author_Institution :
IBM T.J. Watson Research Center, 1101 Kitchawan Rd., Yorktown Heights, NY 10598 USA
Abstract :
Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.
Keywords :
Decision support systems
Conference_Titel :
Group IV Photonics (GFP), 2015 IEEE 12th International Conference on
DOI :
10.1109/Group4.2015.7305910
