Title :
High density integration of Germanium photodiodes on CMOS wafer
Author :
S. Malhouitre;P. Grosse;J.M. Hartmann;F. Foumel;M. Wieland;T. van de Peut;C. Kopp
Author_Institution :
CEA, LETI, Minatec Campus, Grenoble, France
Abstract :
Fabrication of high density vertical Germanium photodiodes (PDs) on top of 200 mm CMOS wafers coming from an external foundry is discussed. Optical performances of stand-alone PDs are compared lo those of CMOS-coupled PDs.
Keywords :
"CMOS integrated circuits","Photodiodes","Silicon","Bonding","Lithography","Germanium"
Conference_Titel :
Group IV Photonics (GFP), 2015 IEEE 12th International Conference on
DOI :
10.1109/Group4.2015.7305946
