Failure to short-circuit capability of emerging direct-lead-bonding power module. Comparison with standard interconnection. Application for dedicated fail-safe and fault-tolerant converters embedded in critical applications

The Direct-Lead-Bonding (DLB) interconnection appears to be a promising technology for power-module (PM). Nevertheless, the absence of wire-fuse-effect in case of extreme failure, compared to classical wire-bonding, leads authors to rethink fail-safe and fault-tolerant strategies for critical converter. Therefore, this paper will provide a comparative study between these two designs in terms of failure-mode and post-fault high-current capability.