Title :
Enabling Scaling of Advanced CMOS Technologies: A Reliability Perspective
Author :
Tanya Nigam;Andreas Kerber
Author_Institution :
GLOBALFOUNDRIES, Santa Clara, CA, USA
fDate :
7/1/2015 12:00:00 AM
Abstract :
As CMOS technologies continue to scale and devices become more interconnected, new reliability challenges are emerging. With Internet-of-Things, semiconductor devices will be ubiquitous and used under diverse environmental conditions. In this paper we will review the device level scaling challenges from the reliability perspective, which include new materials, variability in ever decreasing dimensions, and methodology enhancements needed to provide reliable solutions across different product segments. The critical need for product level reliability assessment will be highlighted to provide additional margin for the consumer market.
Keywords :
"Materials reliability","Dielectrics","Random access memory","Logic gates","CMOS integrated circuits","CMOS technology"
Conference_Titel :
VLSI (ISVLSI), 2015 IEEE Computer Society Annual Symposium on
DOI :
10.1109/ISVLSI.2015.120