Determination of parameters with high impact on fatigue of new Interconnect Technologies

The point of highest mechanical load in an interconnect layer, where crack propagation will start, depends strongly on geometry and material of the attached die as it was already indicated by the CIPS08 lifetime model for insulated models [1]. Therefore, simulations with the following varied geometry parameters were conducted: thickness, area and material of the die as well as thickness of the interconnect layer. Subsequently, the impact of each parameter on the fatigue of the interconnect layer will be discussed.