A thermal estimation model for 3D IC using liquid cooled microchannels and thermal TSVs

3D integrated circuit (3D IC) is becoming challenging for increasing power density and design complexity. Due to vertical integration heat dissipation in 3D IC is increased that creates hotspots on chip and hence temperature of the chip is very serious issue. Traditional fan-based cooling technique is insufficient for 3D ICs. Hence inter-die integrated microchannel cooling technique and dummy thermal Through-Silicon-Vias (TSVs) based techniques are used for controlling thermal behaviour of the chip. In this paper, we have proposed two temperature estimation models for 3D IC based on liquid cooled microchannels and thermal TSVs. Experimental results show that thermal simulation using our approach provide same result compared to [1]. For microfluidic cooling, our proposed thermal simulator is much more accurate than proposed model [2] and less than 0.5% error respect to simulation result with COMSOL thermal simulator using the same experimental environment of [2].