• DocumentCode
    3682893
  • Title

    Envelope Modulator & X-Band MMICs on Highly Integrated 3D Tunable Microcoax Substrate

  • Author

    D. F. Kimball;H. Kazeimi;J. J. Yan;P. T. Theilmann;I. Telleiz;G. Collins

  • Author_Institution
    MaXentric Technol., LLC, La Jolla, CA, USA
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As next generation wireless communication systems move to higher data rates, the bandwidth (BW) and peak to average power ratio (PAPR) of the signal increase. Envelope tracking power amplifier systems provide a means to efficiently amplify these complex waveforms. Envelope power modulators, which achieve greater than 70% EA efficiency while reproducing the envelope of up to 100MHz (DC-500 MHz envelope bandwidth) LTE signals, paired with various amplifiers are presented with high efficiency and linearity. This result for a wide band signal represents the current record state of the art for envelope tracking high power amplifiers.
  • Keywords
    "Bandwidth","Power amplifiers","Modulation","Peak to average power ratio","Gallium nitride","Radio frequency","MMICs"
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICS), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/CSICS.2015.7314500
  • Filename
    7314500
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3682893