• DocumentCode
    3683138
  • Title

    ESD protection design in active-lite interposer for 2.5 and 3D systems-in-package

  • Author

    Mirko Scholz;Geert Hellings; Shih-Hung Chen;Dimitri Linten;Mikael Detalle;Cesar Roda Neve;A. Shibkov;Antonio La Manna;Geert van der Plas;Eric Beyne

  • Author_Institution
    imec, Leuven, Belgium
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Adding low-cost front-end processing to a passive interposer process flow enables the low-cost processing of diodes, SCRs and bipolar transistors. Using those devices in an ESD protection design allows moving a large part of the ESD protection from the stacked die to the interposer.
  • Keywords
    "Electrostatic discharges","Silicidation","Anodes","Cathodes","Silicides","Stress","Capacitance"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2015 37th
  • Type

    conf

  • DOI
    10.1109/EOSESD.2015.7314774
  • Filename
    7314774
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3683138