• DocumentCode
    3683149
  • Title

    A study of the effect of remote CDM clamps in integrated circuits

  • Author

    Dolphin Abessolo-Bidzo;Theo Smedes;Peter C. de Jong

  • Author_Institution
    NXP Semiconductors, Gerstweg 2, 6534 AE Nijmegen, the Netherlands
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Cross-domain signals are the largest ESD risk in integrated circuits nowadays. In this paper, a study of the effect of remote CDM clamps in IC´s is presented. Predictive ESD simulations are demonstrated by TLP and vf-TLP characterizations and by means of HBM and CDM qualifications of a dedicated ESD testchip.
  • Keywords
    "Electrostatic discharges","Clamps","Integrated circuit modeling","Logic gates","Receivers","Substrates"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2015 37th
  • Type

    conf

  • DOI
    10.1109/EOSESD.2015.7314787
  • Filename
    7314787
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3683149