Separation Characteristics of an LMPA-Polymer Mixture for the Encapsulation of Organic Light-Emitting Diode

Author

Hyun-Su Choi ; Hye-Kyung Kwon ; Keun-Soo Kim ; Joon-Sik Park ; Choel-Hee Moon

Author_Institution

Dept. of Display Eng., Hoseo Univ., Asan, South Korea

Volume

4

Issue

7

fYear

2014

fDate

Jul-14

Firstpage

1131

Lastpage

1135

Abstract

An encapsulation method using the separation of low melting point alloy (LMPA) and a polymer from an LMPA-polymer mixture is proposed. Sn-Bi alloy and epoxy were used for the mixture. Separation was conducted using a two-step heat treatment of 160 °C for 5 min and 180 °C for 5 min. We found that the flux contained in the Sn-Bi solder played an important role in the separation process. A Cu sacrificial layer was introduced using the sputtering method under the Sn-Bi layer with thickness variations of 1500, 3000, and 6000 Å. Using the 6000-Å-thick Cu layer, the LMPA formed a well-separated and continuous sealing line. This double-line structure shows good potential for use as a sealing line for organic light-emitting diode encapsulation.

Keywords

encapsulation; heat treatment; organic light emitting diodes; seals (stoppers); sputter deposition; LMPA-polymer mixture; Sn-Bi; double-line structure; epoxy; low melting point alloy; organic light-emitting diode encapsulation; sacrificial layer; sealing line; separation characteristics; separation process; sputtering method; temperature 160 C; temperature 180 C; time 5 min; two-step heat treatment; Educational institutions; Encapsulation; Glass; Heat treatment; Metals; Organic light emitting diodes; Polymers; Encapsulation; epoxy; low melting point alloy (LMPA); organic light-emitting diode (OLED); sealing; sealing.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2324573

Filename

6825861