Title :
Silicon photonics packaging on board-level
Author :
Lars Brusberg;Daniel Weber;Dominik Pernthaler;Biswajit Mukhopadhyay;Gunnar Bottger;Henning Schroder;Tolga Tekin
Author_Institution :
Fraunhofer Inst. for Reliability &
Abstract :
The ongoing development focuses on low-loss single-mode glass waveguide panel integration in multi-layer electro-optical circuit boards (EOCB) and optical interconnection by micro-optics to the grating couplers of such assembled silicon photonic chips.
Keywords :
Position measurement
Conference_Titel :
Photonics Conference (IPC), 2015
DOI :
10.1109/IPCon.2015.7323521
