Heterogeneously integrated silicon lasers for optical interconnects

Aurrion heterogeneous platform combines best-in-class active III-V materials for lasers, modulators and photodetectors with advanced passive components on a single chip. By leveraging existing silicon industry infrastructure for manufacturing and packaging, low-cost photonics can be closely integrated with electronics in system-in-package solutions. Such solutions are well suited to meet the demands of next generation optical interconnects.