• DocumentCode
    3688979
  • Title

    Charge trapping in gate-drain access region of AlGaN/GaN MIS-HEMTs after drain stress

  • Author

    S. A. Jauss;S. Schwaiger;W. Daves;S. Noll;O. Ambacher

  • Author_Institution
    Robert Bosch GmbH, Robert-Bosch-Campus 1, 70839 Gerlingen, Germany
  • fYear
    2015
  • Firstpage
    56
  • Lastpage
    59
  • Abstract
    In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MIS-HEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.
  • Keywords
    "Logic gates","Silicon compounds","Gallium nitride","Stress","Aluminum gallium nitride","Wide band gap semiconductors","Dielectrics"
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference (ESSDERC), 2015 45th European
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4673-7133-9
  • Electronic_ISBN
    2378-6558
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2015.7324712
  • Filename
    7324712