Title :
Design, characterization and signal integrity analysis of a 2.5 Gb/s High-Speed Serial Interface for automotive applications overarching the chip/PCB wall
Author :
A. Cossettini;A. Cristofoli;W. Grollitsch;L. Alves;R. Nonis;L. Della Ricca;P. Palestri;L. Selmi
Author_Institution :
University of Udine, Italy
Abstract :
A 2.5 Gb/s high-speed serial transmitter for automotive applications has been designed and a circuit/package/board integrated simulation procedure has been set up, enabling the co-design of High-Speed-Serial Interfaces. This simulation methodology employs transistor level models of the transmitter combined with physical-based models of the transmission channel, thus no simplified behavioral models are needed. Model/hardware correlation is reported, including eye closure and jitter effects. Good mutual agreement is found between experiments and simulations.
Keywords :
"Transmitters","Integrated circuit modeling","Jitter","CMOS integrated circuits","Impedance","Transistors"
Conference_Titel :
Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI), 2015 IEEE 1st International Forum on
DOI :
10.1109/RTSI.2015.7325068
