• DocumentCode
    3689825
  • Title

    Simple test vehicle for metal fill and resistance of sub-8nm nanowire

  • Author

    Seung Hoon Sung;Jasmeet Chawla;Colin Carver;Ramanan Chebiam;James Clarke;Chris Jezewski;Tristan Tronic;Bob Turkot;Hui Jae Yoo

  • Author_Institution
    Components Research, Intel Corporation, 5200 NE Elam Young Pkwy, Hillsboro, Oregon, 97124 USA
  • fYear
    2015
  • fDate
    5/1/2015 12:00:00 AM
  • Firstpage
    87
  • Lastpage
    90
  • Abstract
    Assessing metal gap fill capability and electrical behavior in patterned features ahead of full integration is valuable in interconnect process development as feature sizes scale beyond the 14 nm technology node. In this work a simple device is fabricated with existing silicon patterning recipes to achieve an electrical test vehicle that can test a range of metal candidates for interconnects. The vehicle is characterized using electron microscopy and electrical measurements.
  • Keywords
    Decision support systems
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International
  • ISSN
    2380-632X
  • Electronic_ISBN
    2380-6338
  • Type

    conf

  • DOI
    10.1109/IITC-MAM.2015.7325633
  • Filename
    7325633
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3689825