• DocumentCode
    3689843
  • Title

    Compact model for solder bump electromigration failure

  • Author

    H. Ceric;S. Selberherr

  • Author_Institution
    Institute for Microelectronics, TU Wien Guß
  • fYear
    2015
  • fDate
    5/1/2015 12:00:00 AM
  • Firstpage
    159
  • Lastpage
    162
  • Abstract
    The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. In this paper we present a compact model for prediction of the mean-time-to-failure of solder bumps under the influence of electromigration.
  • Keywords
    "Stress","Mathematical model","Electromigration","Current density","Reliability","Adaptation models","Semiconductor process modeling"
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International
  • ISSN
    2380-632X
  • Electronic_ISBN
    2380-6338
  • Type

    conf

  • DOI
    10.1109/IITC-MAM.2015.7325651
  • Filename
    7325651
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3689843