DocumentCode
3689850
Title
Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Author
David Gross;Sabine Haag;Manfred Reinold;Martin Schneider-Ramelow;Klaus-Dieter Lang
Author_Institution
Robert Bosch GmbH, Robert-Bosch-Str. 2, 71701 Schwieberdingen, Germany
fYear
2015
fDate
5/1/2015 12:00:00 AM
Firstpage
233
Lastpage
236
Abstract
Thick electroplated Cu bond pads have lately been demonstrated to enable heavy Cu wire-bonding but the Cu oxides necessitate an additional cleaning step after the die-attach. To avoid such cleaning, the use of a thin Al layer is tested for its passivating ability on Cu bond pads and its suitability for the bonding process. Results show a significant improvement of the oxidation resistance and bonding performance.
Keywords
"Annealing","Bonding","Oxidation","Copper","Acoustics","Wires","Surface treatment"
Publisher
ieee
Conference_Titel
Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International
ISSN
2380-632X
Electronic_ISBN
2380-6338
Type
conf
DOI
10.1109/IITC-MAM.2015.7325658
Filename
7325658
Link To Document