[Front cover]

The following topics are dealt with: high-sensitivity negative-tone imaging materials; EUV exposure; I-fuse: disruptive OTP technology; excellent manufacturability; capacitance density; breakdown voltage improvement; PECVD dielectric film characteristics; metal insulator metal capacitors; FOUP/LPU system; advanced semiconductor manufacturing process; advanced on-tool temperature sensor; process integration; dishing; erosion amount prediction; pattern density calculation algorithm; 3D design layout; in-line analysis; noble metallic impurities; silicon wafer surface; particle removal efficiency; high temperature sulfuric acid; liquid particle counter;data analytics; semiconductor industry; tool log mining; productivity improvement; intelligent sensitivity tracking; manufacturing tool tuning; text mining; unstructured data; nondestructive testing; chip multilayer weak pattern; real time detection; probe capability; optimization; MPCPS; production control system; lot level; mass volume production dispatching rules; output optimization; wafer fab; wait time measurement; nonproductive process; process units; flaked particles instantaneous generation; microarc discharge; detection method; load impedance; data fusion; seamless sensor integration; APC; six sigma approach; device bad trimming issue elimination; inspection sensitivity improvement; wafer sort failure sites matching Algorithm; highly effective chipping monitor; high throughput chipping monitor; wafer cracking prevention; advanced high accuracy scanning electron microscopy review methodology; virtual defect; adaptive probing; wafer level chip scale package; skip ink issue; pattern damage; slurry behavior analysis; CMP process; mechanical simulation and fluid simulation.