Modified ELTRAN® — A game changer for Monolithic 3D

It is well recognized that dimensional scaling has reached its diminishing return phase and the industry is now looking to monolithic 3D to be the future technology driver. This was clearly voiced in the Qualcomm keynote at DAC 2014 and follow-on presentation at ISPD 2015. This paper will present a novel use of the ELTRAN® process developed by Canon Inc. about 20 years ago primarily for SOI applications. Using ELTRAN techniques, a substrate could be prepared enabling any fab to simply integrate a monolithic 3D device without the need to change the current frontline fab process. This flow is further simplified and could be integrated with the game changing monolithic 3D flow introduced last year which leverages the emerging precision bonders, such as EVG´s Gemini® XT FB. This flow provides a natural path for product innovation and an unparalleled competitive edge. In addition, this game-changer breakthrough offers a very cost competitive flow.