Electrical interconnect test method of 3D ICs by injected charge volume

In this paper, an electrical test method and a power supply circuit are proposed for open defects at interconnects between dies in a 3D IC. The test method is based on volume of charge injected from the power supply circuit. Feasibility of the electrical tests is examined by Spice simulation. The simulation results show that a hard open defect, capacitive ones and resistive ones whose resistance is greater than or equal to 100Ω may be detected at a test speed of 0.9MHz.