• DocumentCode
    3697358
  • Title

    Reliability of high power semiconductor lasers on bonding and mounting design

  • Author

    Yu-Chen Chen;Gray Lin

  • Author_Institution
    Dept. of Electronics Eng. &
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Reliability of high-power semiconductor lasers can be underestimated because of imperfect bonding and improper mounting. The C-mount package of Cu material is replaced with CuW material and high power laser chips are bonded above without AlN submount. For the burn-in test, liquid-metal alloy is applied between C-mount and heatsink to improve thermal contact. The estimated lifetime of 4 W, 808 nm lasers is therefore greatly increased to over 3600 hours.
  • Keywords
    "Heating","Thermal resistance","Bonding","Reliability","Electronic packaging thermal management","Thermal conductivity"
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronics Global Conference (OGC), 2015
  • Print_ISBN
    978-1-4673-7731-7
  • Type

    conf

  • DOI
    10.1109/OGC.2015.7336834
  • Filename
    7336834
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3697358