Title :
Reliability of high power semiconductor lasers on bonding and mounting design
Author :
Yu-Chen Chen;Gray Lin
Author_Institution :
Dept. of Electronics Eng. &
Abstract :
Reliability of high-power semiconductor lasers can be underestimated because of imperfect bonding and improper mounting. The C-mount package of Cu material is replaced with CuW material and high power laser chips are bonded above without AlN submount. For the burn-in test, liquid-metal alloy is applied between C-mount and heatsink to improve thermal contact. The estimated lifetime of 4 W, 808 nm lasers is therefore greatly increased to over 3600 hours.
Keywords :
"Heating","Thermal resistance","Bonding","Reliability","Electronic packaging thermal management","Thermal conductivity"
Conference_Titel :
Optoelectronics Global Conference (OGC), 2015
Print_ISBN :
978-1-4673-7731-7
DOI :
10.1109/OGC.2015.7336834
