Title :
Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation
Author :
K. S. Kaur;A. Z. Subramanian;R. Verplancke;P. Cardile;J. Van Kerrebrouck;S. Spiga;R. Meyer;J. Bauwelinck;R. Baets;G. Van Steenberge
Author_Institution :
Centre for Microsystems Technology, imec/Ghent University, B-9052 Gent, Belgium
Abstract :
We successfully demonstrate for the first time, VCSEL-to-silicon grating coupler flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of <; 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved.
Keywords :
"Vertical cavity surface emitting lasers","Bonding","Assembly","Loss measurement","Flip-chip devices","Semiconductor device measurement","Couplings"
Conference_Titel :
Optical Communication (ECOC), 2015 European Conference on
DOI :
10.1109/ECOC.2015.7341726
