DocumentCode
3701291
Title
3D integrated hybrid silicon laser
Author
Bowen Song;Pietro Contu;Cristian Stagarescu;Sergio Pinna;Payam Abolghasem;Sasa Ristic;Nathan Bickel;Jason Bowker;Alex Behfar;Jonathan Klamkin
Author_Institution
Electrical and Computer Engineering Dept., Boston University, Boston, MA, USA
fYear
2015
Firstpage
1
Lastpage
3
Abstract
A laser is realized by flip-chip bonding an indium phosphide reflective semiconductor optical amplifier with a turning mirror to a silicon photonic circuit with a surface grating coupler. An external cavity laser is formed and single-mode CW lasing is demonstrated.
Keywords
"Silicon","Indium phosphide","III-V semiconductor materials","Three-dimensional displays","Couplings","Bonding","Mirrors"
Publisher
ieee
Conference_Titel
Optical Communication (ECOC), 2015 European Conference on
Type
conf
DOI
10.1109/ECOC.2015.7341989
Filename
7341989
Link To Document