Electrical package defect testing for volume production

This paper introduces a newly conceptualized and invented an electrical test capability for package defect detection based on “Capacitive Testing” for volume production. It is a “first of its kind” package defect testing in the Semiconductor industry, which offers a simple, fast and “fool proof” electrical test for package structural defect, such as “near-short” between adjacent wires and inner leads, which are not detectable in conventional x-ray screening and ATE (automatic electrical equipment) testing. To date, this greenfield package defect testing had achieved significant impact in terms of Quality (zero customer complaints since it is in volume production, 2 years ago), productivity improvement (significantly reduced lot on hold at final test), and high cost avoidance (compare to x-ray screening). Hence, we believe that the further developing and cascading of this new testing technology to industry will contribute significant long term value for our entire customer. The concept with simulation, result validation, and its various application in BE process were discussed in this paper.