On diagnosable and tunable 3D clock network design for lifetime reliability enhancement

In three-dimensional (3D) integrated circuits (IC-s), many clock-TSVs are deployed to deliver clock signals to different tiers with minimum skews. However, these clock-TSVs are prone to aging effects, such as thermal-mechanical stress and electromigration, rendering hard-to-predict clock skews at runtime. These skews have a wide range of influence on the flip-flops, and may violate the safety margins of critical paths in the circuit. Besides the circuit aging effect, the clock-TSV induced skews pose another threat to the circuit lifetime reliability. To tackle this problem, we propose to put tunable buffer for each clock-TSV in the clock network, and introduce an efficient algorithm to place aging sensors in the circuit at design stage. Then, at runtime, we conduct online diagnosis and apply effective clock tuning algorithms based on the triggered alarms in the aging sensors. Experimental results on a post-layout 3D circuit show that the proposed solution is able to significantly improve the lifetime reliability of 3D ICs.