• DocumentCode
    37028
  • Title

    300-GHz Step-Profiled Corrugated Horn Antennas Integrated in LTCC

  • Author

    Tajima, Tsutomu ; Ho-Jin Song ; Ajito, K. ; Yaita, Makoto ; Kukutsu, Naoya

  • Author_Institution
    NTT Device Technol. Labs., NTT Corp., Atsugi, Japan
  • Volume
    62
  • Issue
    11
  • fYear
    2014
  • fDate
    Nov. 2014
  • Firstpage
    5437
  • Lastpage
    5444
  • Abstract
    This paper presents 300-GHz step-profiled corrugated horn antennas, aiming at their integration in low-temperature co-fired ceramic (LTCC) packages. Using substrate integrated waveguide technology, the cavity inside the multi-layer LTCC substrate and a surrounding via fence are used to form a feeding hollow waveguide and horn structure. Owing to the vertical configuration, we were able to design the corrugations and stepped profile of horn antennas to approximate smooth metallic surface. To verify the design experimentally, the LTCC waveguides and horn antennas were fabricated with an LTCC multi-layer process. The LTCC waveguide exhibits insertion loss of 0.6 dB/mm, and the LTCC horn antenna exhibits 18-dBi peak gain and 100-GHz bandwidth with more than 10-dB return loss. The size of the horn antenna is only 5×5×2.8 mm3, which makes it easy to integrate it in LTCC transceiver modules.
  • Keywords
    ceramic packaging; horn antennas; substrate integrated waveguides; LTCC packages; LTCC transceiver modules; bandwidth 100 GHz; frequency 300 GHz; hollow waveguide; horn structure; low-temperature co-fired ceramic packages; step-profiled corrugated horn antennas; substrate integrated waveguide technology; Cavity resonators; Hollow waveguides; Horn antennas; Metals; Slot antennas; Substrates; Dielectric substrates; horn antennas; low-temperature co-fired ceramics (LTCC); terahertz (THz);
  • fLanguage
    English
  • Journal_Title
    Antennas and Propagation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-926X
  • Type

    jour

  • DOI
    10.1109/TAP.2014.2350520
  • Filename
    6880791