Modeling and characterization of bond-wire arrays for distributed Chip-Package-PCB Co-design

In this paper, modeling and experimental characterization of bond-wire arrays are proposed based on dedicated pilote carriers designed and fabricated for RF and microwave applications. Effects of the number of wire elements, connected in parallel to build bond-wire arrays, on the values of extracted broadband parasitics are investigated. Physical characterization of molding compound materials is proposed for their structural analysis and for broadband extraction of their dielctric properties (complex permittivity). Influence of molding compound properties on extracted parasitics of bond-wire arrays is highlighted.