Title :
High-speed serial link challenges using multi-level signaling
Author :
N. Dikhaminjia;J. He;E. Hernandez;M. Tsiklauri;J. Drewniak;A. Chada;M. Zvonkin;B. Mutnury
Author_Institution :
Electromagnetic Compatibility Laboratory, Electrical and Computer Engineering Department, Missouri University of Science and Technology, Rolla, 65401, USA
Abstract :
The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.
Keywords :
"Optical signal processing","Backplanes","Jitter","Modulation","Bandwidth","Decision feedback equalizers","Insertion loss"
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
Print_ISBN :
978-1-5090-0038-8
DOI :
10.1109/EPEPS.2015.7347129
