Title :
A study of conductor modeling using the surface integral equation
Author :
Tian Xia;Hui Gan;Michael Wei;Weng Cho Chew
Author_Institution :
Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, 61801, USA
Abstract :
A rigorous method to solve conductor problems using the surface integral equation is introduced. This formulation is based on the augmented electric field integral equation. In order to model conductors and accurately capture the losses, some integration techniques are analyzed and compared. The line integral method will be an optimal option for conductor problems. After incorporating this technique, this method can be applied to interconnect and packaging problems.
Keywords :
"Conductors","Mathematical model","Integral equations","Surface impedance","Approximation methods","Surface waves"
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
Print_ISBN :
978-1-5090-0038-8
DOI :
10.1109/EPEPS.2015.7347146
