• DocumentCode
    3705461
  • Title

    A study of conductor modeling using the surface integral equation

  • Author

    Tian Xia;Hui Gan;Michael Wei;Weng Cho Chew

  • Author_Institution
    Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, 61801, USA
  • fYear
    2015
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    A rigorous method to solve conductor problems using the surface integral equation is introduced. This formulation is based on the augmented electric field integral equation. In order to model conductors and accurately capture the losses, some integration techniques are analyzed and compared. The line integral method will be an optimal option for conductor problems. After incorporating this technique, this method can be applied to interconnect and packaging problems.
  • Keywords
    "Conductors","Mathematical model","Integral equations","Surface impedance","Approximation methods","Surface waves"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th
  • Print_ISBN
    978-1-5090-0038-8
  • Type

    conf

  • DOI
    10.1109/EPEPS.2015.7347146
  • Filename
    7347146
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3705461