Title :
Live demonstration: Tactile imaging sensor for mechanical properties quantification of breast tumor
Author :
Vira Oleksyuk;Firdous Saleheen;William Moser;Chang-Hee Won
Author_Institution :
Department of Electrical and Computer Engineering, Temple University, Philadelphia, PA 19122
Abstract :
In this live demonstration, a Tactile Imaging Sensor is presented, which is used for quantifying the mechanical properties of breast tumor. A tumor or malignancy feels different from the tissue surrounding it, which motivates the development of this system. Currently, a subjective method of clinical breast examination is performed for early detection of breast cancer. The method only provides qualitative information about the size and elastic modulus of suspicious lesion. To complement this method, we introduce a tactile imaging sensor that provides quantitative interpretations of the mechanical properties of embedded inclusion. In this sensor, a flexible Polydimethylsiloxane (PDMS) optical waveguide is used as the sensing probe. The sensing probe is illuminated by light emitting diodes in such a way that the total internal reflection occurs. When the embedded inclusion is compressed from the surface by the probe, the internally reflected light inside the probe is scattered. This scattered light is then captured by a near-infra-red CMOS camera, and forms the tactile images. Simultaneously, a load cell records the force reading. These images and force readings are then analyzed for estimating the size and elastic modulus of the embedded inclusion. This high resolution optical sensor offers a non-invasive and non-ionized technique for tumor screening. It is also a cost-effective and portable system, which requires minimal training of the operator. The demo will highlight the sensor use by estimating the mechanical properties of embedded inclusions inside a silicone phantom.
Keywords :
"Imaging","Mechanical factors","Probes","Optical waveguides","Imaging phantoms","Tumors","Optical sensors"
Conference_Titel :
Biomedical Circuits and Systems Conference (BioCAS), 2015 IEEE
DOI :
10.1109/BioCAS.2015.7348329