DocumentCode :
3706341
Title :
Back biases and positive bias temperature instability on low and high doped ultrathin body and buried oxide siliocn-on-insulator
Author :
Wen-Teng Chang;Sheng-Ting Shih; Chien-Hung; Yeh;Wen-Kuan Yeh
Author_Institution :
Department of Electrical Engineering, National University of Kaohsiung, Taiwan
fYear :
2014
fDate :
6/1/2014 12:00:00 AM
Firstpage :
1
Lastpage :
2
Abstract :
This study addresses low- and high-doped ultra-thin body and buried oxide silicon-on-insulator (UTBB-SOI) nFETs related to back biases and reliability. The low-doped device shows wider tuning range and lower subthreshold and gate leakage despite lower transconductance. Positive bias temperature instability in low-doped UTBB-SOI degraded lower than that in high-doped device.
Keywords :
"Logic gates","Stress","Doping","Gate leakage","Transconductance","Transistors"
Publisher :
ieee
Conference_Titel :
Silicon Nanoelectronics Workshop (SNW), 2014 IEEE
Print_ISBN :
978-1-4799-5676-0
Type :
conf
DOI :
10.1109/SNW.2014.7348578
Filename :
7348578
Link To Document :
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