DocumentCode
3708904
Title
Control Method to Increase the Reliability of IGBT Power Modules Validated on a Three Phase Inverter
Author
Julian Wolfle;Jorg Roth-Stielow;Oliver Koller;Bernd Bertsche
Author_Institution
Inst. of Power Electron. &
fYear
2015
Firstpage
1
Lastpage
6
Abstract
This paper presents a junction temperature controller which increases the reliability of IGBT power modules in power electronic applications without affecting the demanded output power. Power electronic applications have to deal with varying load conditions. These varying load conditions lead to temperature swings which lead to mechanical stress of common IGBT power modules. At low load conditions the switching losses are increased by increasing the switching frequency. This leads to reduced temperature swings resulting in a higher reliability. The functionality of the control system is verified on a three phase two level inverter connected to a passive load.
Keywords
"Temperature control","Insulated gate bipolar transistors","Temperature measurement","Junctions","Multichip modules","Reliability"
Publisher
ieee
Conference_Titel
Vehicle Power and Propulsion Conference (VPPC), 2015 IEEE
Type
conf
DOI
10.1109/VPPC.2015.7352918
Filename
7352918
Link To Document