• DocumentCode
    3710643
  • Title

    Reactive Ion etching of TiO2 thin film: The impact of different gaseous

  • Author

    R. Adzhri;M. K. Md Arshad;M. F. M. Fathil;U. Hashim;A. R Ruslinda;R. M. Ayub;Subash C. B. Gopinath;C. H. Voon;K. L Foo;M. N. M. Nuzaihan;A. H. Azman;M. Zaki

  • Author_Institution
    Institute of Nano Electronic Engineering, Universiti Malaysia Perlis, Kangar, Perlis, Malaysia
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Titanium dioxide (TiO2) is one of a metal oxide material group that shows a promising future in biosensors application. TiO2 possess both physical and chemical resistant that can extend a device lifespan. However, etching of TiO2 with very high selectivity is a challenging process in achieving good and desired profile particularly in nanometer scale. In this work, we present the anisotropic etch profile. Three types of ICP-RIE recipes are used i.e. CF4/O2, Ar/SF6 and CF4/Ar. Prior to that, the TiO2 sol-gel is deposited on top of SiO2 layer. All the results are optically and physically characterized by using 3D-surface profilometer and atomic force microscopy (AFM) and finally followed by electrical characterization.
  • Keywords
    "Etching","Surface morphology","Surface topography","Aluminum","Silicon","Fabrication"
  • Publisher
    ieee
  • Conference_Titel
    Micro and Nanoelectronics (RSM), 2015 IEEE Regional Symposium on
  • Type

    conf

  • DOI
    10.1109/RSM.2015.7354999
  • Filename
    7354999