DocumentCode :
3710643
Title :
Reactive Ion etching of TiO2 thin film: The impact of different gaseous
Author :
R. Adzhri;M. K. Md Arshad;M. F. M. Fathil;U. Hashim;A. R Ruslinda;R. M. Ayub;Subash C. B. Gopinath;C. H. Voon;K. L Foo;M. N. M. Nuzaihan;A. H. Azman;M. Zaki
Author_Institution :
Institute of Nano Electronic Engineering, Universiti Malaysia Perlis, Kangar, Perlis, Malaysia
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
Titanium dioxide (TiO2) is one of a metal oxide material group that shows a promising future in biosensors application. TiO2 possess both physical and chemical resistant that can extend a device lifespan. However, etching of TiO2 with very high selectivity is a challenging process in achieving good and desired profile particularly in nanometer scale. In this work, we present the anisotropic etch profile. Three types of ICP-RIE recipes are used i.e. CF4/O2, Ar/SF6 and CF4/Ar. Prior to that, the TiO2 sol-gel is deposited on top of SiO2 layer. All the results are optically and physically characterized by using 3D-surface profilometer and atomic force microscopy (AFM) and finally followed by electrical characterization.
Keywords :
"Etching","Surface morphology","Surface topography","Aluminum","Silicon","Fabrication"
Publisher :
ieee
Conference_Titel :
Micro and Nanoelectronics (RSM), 2015 IEEE Regional Symposium on
Type :
conf
DOI :
10.1109/RSM.2015.7354999
Filename :
7354999
Link To Document :
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