• DocumentCode
    37113
  • Title

    Characterization and Modeling of the Conducted Emission of Integrated Circuits Up To 3 GHz

  • Author

    Berbel, Nestor ; Fernandez-Garcia, Raul ; Gil, Iñigo

  • Author_Institution
    Dept. of Electron. Eng., Univ. Politec. de Catalunya, Terrassa, Spain
  • Volume
    56
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    878
  • Lastpage
    884
  • Abstract
    In this paper, an electrical model in order to predict the electromagnetic compatibility (EMC) conducted emission of integrated circuits (ICs) up to 3 GHz is presented. The electrical model predicts the behavior of the propagation paths of electromagnetic conducted emissions at high frequency by including all distributed effects and capacitive and inductive couplings. The proposed model has been compared with the standard IC emission model (ICEM-CE) to predict the EMC of a clock generator by means of the feature selective validation (FSV) method. The results show that the proposed model can expand the frequency range up to 3 GHz with a high degree of accuracy. Moreover, an alternative approach to model the electromagnetic noise that is based on the analysis of its spectral components is proposed.
  • Keywords
    UHF integrated circuits; electromagnetic compatibility; microwave integrated circuits; EMC prediction; FSV method; ICEM-CE; capacitive couplings; clock generator; distributed effects; electrical model; electromagnetic compatibility; electromagnetic conducted emissions; electromagnetic noise; feature selective validation method; inductive couplings; integrated circuits; propagation paths; spectral components; standard IC emission model; Electromagnetic compatibility; Impedance; Integrated circuit modeling; Predictive models; Standards; Transmission line measurements; Conducted emissions; IC emission model (ICEM-CE); electromagnetic compatibility (EMC); feature selective validation (FSV); integrated circuit (IC); internal activity (IA);
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2013.2294256
  • Filename
    6691947