Spectroscopic electromagnetic analysis approach to non-contact circuit board test and diagnosis

Described in this paper is ongoing research in the development of methods to detect failures and anomalies within electronic components and printed circuit boards based upon observations of the interaction of energy applied to their physical materials and consequent radiated emissions that lie within the electromagnetic spectrum. These emissions are created using stimulus applied directly to power and signal input/output connections and indirectly using non-contact methods, and may be detected, analyzed and interpreted to make diagnostic and prognostic determinations for printed circuit boards and electronic components. Non-contact sensing of emissions provides unlimited virtual connections to signals generated by internal devices and circuits, resolving limitations inherent to physical I/O connectors. Results achievable using this method are described in terms of fault resolution and isolation, and the ability to distinguish between actual and pending failures.