The future of component level Miniature and Microminiature Electronic Repair

When discussing component level electronics maintenance, most people think of diagnostics - find the fault and your problem is solved. However, there is another side of electronics repair that has been neglected. After diagnosis, it has become increasingly difficult to physically repair the electronics. Such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards and intricate component packages (e.g. BGA´s) that are difficult to install. As a result, many DoD Depot/Intermediate facilities have lost the organic capability to repair modern electronics, opting to hire outside contractors to perform the more difficult repairs. This paper will review the history and current status of NAVSEA´s 2M (Miniature/Microminiature) Electronics Repair Program, which provides the tools and techniques required for certified Navy, Marine Corps, Air Force (under the AFREP Program) and Coast Guard electronic repair technicians to perform highly reliable, high quality repairs on complex circuit card assemblies. Current capabilities of key electronics repair Depots will also be examined, including Tobyhanna Army Depot, Robins AFB, FRC Southeast, MCLB Albany and others. Finally, we will analyze future technologies that may impact DoD´s ability to maintain an organic repair capability.