DocumentCode
3712563
Title
[Copyright notice]
fYear
2015
Firstpage
1
Lastpage
1
Abstract
The following topics are dealt with: on-board optics; materials for advanced packaging processes and flexible devices; fan-out package; polymer waveguides; thermal management; optical links; bioelectronics; 3D package; waveguide technologies; advance package technologies; 3D printing; optical connectivity; electrical interconnect; and silicon photonics.
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2015 IEEE
Print_ISBN
978-1-4799-8814-3
Type
conf
DOI
10.1109/ICSJ.2015.7357340
Filename
7357340
Link To Document