Thermal modeling analysis of the IGBT integration shunt model

For an IGBT driver, the current detection and protection function is of great importance. Although the shunt could be cascaded with the emitter of the IGBT to detect the collector´s current without any delay, there would be a significant power consumption. Therefore heat dissipation of the shunt is the key problem to be solved. In this paper, the shunt is integrated in a Direct Bonding Copper (DBC) baseplate to solve the heat dissipation problem. The thermal model of a 1200V/800A IGBT module is developed with the three-dimensional finite element method (3-D FEM) using the ANSYS software package. The simulation results prove that it is feasible to solve the heat dissipation problem by integrating the shunt with the DBC baseplate.