DocumentCode
37168
Title
Education and student activities committee (ESAC)
Volume
3
Issue
4
fYear
2014
fDate
4th Quarter 2014
Firstpage
26
Lastpage
26
Abstract
I am sure you agree with me that this year´s EMC symposium was certainly one of the best in recent years due to the high quality technical content (in both EMC and SI/PI), the venue, and the social events!
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2014.7022506
Filename
7022506
Link To Document