Single chip wireless condition monitoring of power semiconductor modules

A concept for doing accurate monitoring of temperature in power semiconductor modules is proposed. The concept involves glueing wireless single-chip temperature sensors with on-chip coils in direct contact with power semiconductor devices within their modules. Direct contact results in accurate temperature measurements while wireless technology such as RFID provides galvanic isolation from the power devices. An overview of the electromagnetic situation within wire bond power semiconductor modules is presented and a prototype chip with an on-chip coil has been manufactured as an initial attempt to investigate the feasibility of the concept. Measurements on said chip provides some insight in the challenges in on-chip coil designs. The feasibility of the concept is supported by earlier work that have demonstrated high power transfer efficiencies and a low power temperature sensor that is able to operate at high temperatures.