Copper metallization technology on bare Glass substrate

Fabrication of metal circuits on the Glass substrate is one of the key technologies to enhance the performance of next generation electronic devices. Metal circuits were created without roughening the surface of glass substrate by wet plating process with subtractive process. Surface cleaning is critical to obtain good adhesion. In this experiment, glass surface was cleaned by the irradiation of UV light and alkaline degreasing with complex agent. UV light and alkaline degreasing make the clean surface of the glass. Consequently, the enhanced and uniform metal deposition enabled good adhesion between the glass and the deposited copper. This new glass plating process has an intrinsic advantage for the formation of fine patterned glass substrate.