Title :
Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment
Author :
Yao-Shing Chen;Shih-Jue Lin;Ben-Je Lwo
Author_Institution :
Department of Mechanical and Aerospace Engineering, Chung-Cheng Institute of Technology, National Defense University, Taiwan
Abstract :
This paper developed a new methodology which is a sandwich-like platform to measure Seebeck coefficient for single layer thin-film thermoelectric devices which are flexible and wearable without environmental limitation. With our new apparatus, a stably controlled temperature gradient environment is created on thin-film test samples so that the commonly used and simple probing can be employed for Seebeck coefficient measurements. This paper finally verified the accuracy and availability of the new experimental design through Seebeck coefficient measurements on a typical organic conductive material (PEDOT).
Keywords :
"Temperature measurement","Temperature control","Thermoelectric devices","Temperature distribution","Substrates","Semiconductor device measurement","Bridge circuits"
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International
Print_ISBN :
978-1-4673-9690-5
DOI :
10.1109/IMPACT.2015.7365204