Millimeter-wave antenna-in-package solutions for WiGig and backhaul applications

This paper provides an overview of the authors´ research work to develop low-cost antennas and packaging technologies for 60GHz and 120GHz high speed data rate communications. First, a WiGig module designed in a low cost High-Density-Interconnect organic packaging technology is briefly depicted. The linearly polarized antennas integrated in a 12×12×0.5 mm3 ball-grid-array module exhibit a realized gain higher than 5 dBi over the entire WiGig band. Then, in order to address the Millimeter-Wave backhaul applications while leveraging the previous achievement, a lens-casing solution is proposed. The achievable performance with a plastic (ABS-M30) lens manufactured using a rapid 3D printing prototyping technique is validated at both 60 GHz and 120 GHz.