• DocumentCode
    3720880
  • Title

    Modal analysis of a metallic via hole by the WCIP

  • Author

    Georgina K. de F. Serres;Alexandre J. R. Serres;Raimundo C. S. Freire;Henri Baudrand

  • Author_Institution
    Post-Graduate Program in Electrical Engineering - COPELE, Federal University of Campina Grande, UFCG, Brazil
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper presents a new electromagnetic modeling of a via-hole using a Wave Concept Iterative Procedure. There are specific TM modes associated with the insertion of the via-hole influencing the incident and reflected waves, called the “via´s modes”. The formulation and results are presented considering the influence of one and two via´s mode. The advantage of the model presented is the possibility to simulate planar circuits with a layer and a via-hole considering the effects of the field that propagates around the via.
  • Keywords
    "Manganese","Microstrip","Integrated circuit modeling","Current density","Mathematical model","Impedance","Resonant frequency"
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Optoelectronics Conference (IMOC), 2015 SBMO/IEEE MTT-S International
  • Type

    conf

  • DOI
    10.1109/IMOC.2015.7369091
  • Filename
    7369091
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3720880