Heat conduction in multi-layer circuit elements

We study an analytic heat conduction model of a composite, layered system and utilise the Green´s function formalism in constructing the solution of the dynamical equation. The layers are thermally perfectly coupled, but they are different in their electrical properties which may change with temperature. Such inherent difference in material parameters leads to thermal delays and we demonstrate that it may even cause apparent hysteretic behaviour in an observed electrical quantity. The thermal behaviour of most electronic components are examined and characterised within the factory. The presented model can be applied both during the characterisation procedure and also could be implements efficiently in the electronic component itself.