DocumentCode
3723336
Title
Mitigating the power density and temperature problems in the nano-era
Author
Muhammad Shafique;J?rg Henkel
Author_Institution
Embedded Systems (CES), Karlsruhe Institute of Technology (KIT), Germany
fYear
2015
Firstpage
176
Lastpage
177
Abstract
This paper introduces the power-density and temperature induced issues in the modern on-chip systems. In particular, the emerging Dark Silicon problem is discussed along with critical research challenges. Afterwards, an overview of key research efforts and concepts is presented that leverage dark silicon for performance and reliability optimization. In case temperature constraints are violated, an efficient dynamic thermal management technique is employed.
Keywords
"Silicon","Reliability","Boosting","Aging","Density measurement","Power system measurements","Optimization"
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2015 IEEE/ACM International Conference on
Type
conf
DOI
10.1109/ICCAD.2015.7372567
Filename
7372567
Link To Document